Report Information Report Publish Date 5/5/2017 SI Number 45079 Analyst Name T. Mroczkowski Product Description Product Type E-Cigarette Brand Philip Morris Device Name IQOS Device Model # A1402 Official Release Date 11/15/2016 Target Market Worldwide Retail Price $109.99 Weight (grams) 19.6 (Measured) Device Dimensions (mm) 93.3 x 14.7 x 13.9 (Measured at Longest/Widest/Thickest Points) Product Features Operating System Proprietary Processor Spec 16-Bit Mixed Signal Microcontroller RAM Support N/A Connectivity MiniUSB User Interface Trigger, Control & Cover Lock Buttons, LED Indicators Storage N/A Battery Type 3.2 V, 120 mAh, Li-ion (Device); 3.7 V, 2900 mAh, Li-ion (Pocket Charger) Battery Life (Hrs.) 20 puffs / 1 hour charging in pocket charger Learn more... DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information. Copyright © 2017, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or any portion thereof, by any means without the express written permission of TechInsights. Deep Dive Teardown Device Analysis Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Design Wins Design Wins Function Microcontroller (E-Cigarette) Microcontroller (Charger) Battery Charger Manufacturer Texas Instruments Texas Instruments Texas Instruments Part Number MSP430F2272 MSP430F5524 BQ24190 Texas Instruments has almost all of the design wins in the Philip Morris IQOS (A1402) e-cigarette, supplying 13 of the 15 ICs. These include the two microcontrollers (one for the holder & one for the charger) and a Li-ion battery charger IC. 2 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Design Wins Analysis Summary Components Teardown Photos Cost Drivers Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Device Analysis Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Analysis Summary Integrated Circuit Metrics IC Die Count** 16 IC Package Count** 16 The Philip Morris IQOS (A1402) is the company’s first smoke-free e-cigarette in its new line of “reduced-risk products” (RRPs). It allows nicotine to be extracted from tobacco without burning. The entire system includes charger, holder, and tobacco stick. The tobacco stick is inserted into the holder, which resembles a pen, and then heated to 350° C. Instead of smoke, it generates a vapor that contains nicotine. According to the manufacturer, the vapor has less than 10% of the harmful constituents found in regular cigarette smoke and far less odor, though it still contains nicotine and tobacco flavors. Cost Metrics $109.99 Retail Price $19.26 Total Manufacturing Cost* $8.87 Electronics Cost** The charger, holder, and tobacco stick are all solidly constructed and small enough to fit into a shirt pocket. In fact, they’re smaller than a pack of standard cigarettes. A handy cleaning kit is also included in the package. Manufacturing Cost Breakdown Integrated Circuits $2.98 15.5% Modules, Discretes & Connectors $3.68 19.1% Substrates $0.42 2.2% Component Insertion $1.11 5.8% Card Test $0.21 1.1% Battery Subsystem $3.16 16.4% Non-Electronic Parts $7.16 37.2% Final Assembly & Test $0.55 2.8% $19.26 100.0% Total Most of the minor ICs used here (such as the LDOs and converter) have been seen in previous analyses. The main #MSP430F2272 microcontroller has been seen before in the Honeywell Prestige IAQ programmable thermostat. The #MSP430F5524 microcontroller in the charger has been seen four times before, most recently in the Honeywell Wireless Adapter THM4000R1000. *Excluding Supporting Materials' Cost **Including Subsystems 3 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Design Wins Analysis Summary Components Teardown Photos Cost Drivers Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Device Analysis Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Item 83 50 85 51 52 2 45 53 1 71 Function Supporting Materials Subsystems Insertion Non-Electronics Non-Electronics Mixed Signal Other Non-Electronics Mixed Signal Non-Electronics Cost Drivers Component Category Location Description Pkg Form Battery Subsystem Charger Main Enclosures Charger Main Enclosures Charger Main Board - Side 1 Main Board - Side 2 Charger Main Enclosures Main Board - Side 1 Device Main Enclosures IC Module IC Top Enclosure Bottom Enclosure 16-Bit Mixed-Signal Microcontroller Misc: Heater Internal Enclosure 16-Bit Mixed Signal Microcontroller Long Enclosure BGA Flip Chip, Solder Qty 1 1 1 1 1 1 1 1 1 1 Piece Cost Extended Cost $3.2100 $3.1596 $1.1065 $1.0500 $1.0500 $0.9900 $0.8900 $0.7900 $0.7000 $0.6600 Pin Pin Count, Count, Each* Total $3.2100 $3.1596 $1.1065 $1.0500 $1.0500 $0.9900 $0.8900 $0.7900 $0.7000 $0.6600 IC Ref # Pkg Brand Pkg PN 64 2 64 2 Main - IC.8 Texas Instruments MSP430F5524 49 49 Main - IC.1 Texas Instruments MSP430F2272 Category Supporting Materials Battery Final Assembly & Test Non-Electronics Non-Electronics Mixed Signal Other Non-Electronics Mixed Signal Non-Electronics $25.00 $22.47 $3.21 Supporting Materials $0.42 $0.66 Substrates $20.00 $4.17 Power Management / Audio $15.00 Other Non-Electronics $7.16 $10.00 Mixed Signal $1.69 Final Assembly & Test $5.00 $1.86 Battery $3.30 Philip Morris IQOS A1402 NOTE: Occasional inconsistencies in totals may be present due to rounding error. 4 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Design Wins Analysis Summary Components Teardown Photos Cost Drivers Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Product Label Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Box Charger Pocket Charger E-cigarette 5 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Supporting Materials Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Total Estimated Cost of Supporting Materials: $3.21 Packaging - $0.69 Documentation - $0.08 USB Cable - $0.45 Cleaner Brush- $0.45 Charger - $1.29 Cleaning Sticks (10 pcs.) - $0.25 6 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Block Diagram Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Manufacturer: Hitachi Texas Instruments System Block Pocket Charger Battery Subsystem #2 15 - Hitachi #MD1508 Battery Surveillance USB 10 - Texas Instruments #BQ24190 Li-ion Battery Charger 8 - Texas Instruments #MSP430F5524 16-Bit Mixed-Signal Microcontroller E-cigarette Module #6 - Li-Ion Battery Cell 1 - Texas Instruments #MSP430F2272 16-Bit Mixed Signal Microcontroller Via MOSFET Module #5 - Heater Estimated block diagram based on observation of this specific product implementation, manufacturer’s data sheets where available, and best engineering judgment. Certain details of the interface circuitry are not reflected in this block diagram. Partitioning and connectivity are speculative. 7 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Features Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Exterior Features Trigger LED Indicator Place for inserting Tobacco Stick 8 Exterior Features Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Features Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Exterior Features 2 9 Exterior Features Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Features Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Exterior Features 3 Pocket Charger Contacts 10 Exterior Features Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Features Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Exterior Features 4 LED Indicators Control Buttons Cover Lock Button 11 Exterior Features Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Features Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Exterior Features 5 miniUSB (Charger Input) 12 Exterior Features Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Features Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Exterior Features 6 13 Exterior Features Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Major Components 1 Side 1 14 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Major Components 1 Side 2 15 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Major Components 2 Side 1 16 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Major Components 2 Side 2 17 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Main Enclosures 1 Side 1 NE #3 - Internal Enclosure NE #2 - Short Enclosure NE #1 - Long Enclosure 18 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Main Enclosures 1 Side 2 NE #3 - Internal Enclosure NE #2 - Short Enclosure NE #1 - Long Enclosure 19 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Main Enclosures 2 Side 1 NE #13 - Top Cover NE #11 - Bottom Enclosure NE #10 - Top Enclosure NE #12 - Internal Enclosure 20 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Main Enclosures 2 Side 2 NE #13 - Top Cover NE #11 - Bottom Enclosure NE #10 - Top Enclosure NE #12 - Internal Enclosure 21 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Component Arrangement 22 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Components Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Component Arrangement 23 Major Components Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Main Enclosures Components Teardown Photos Component Arrangement Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 1 NE #2 - Short Enclosure 24 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 2 NE #6 - Enclosure Support 25 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 3 NE #1 - Long Enclosure 26 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 4 NE #7 - Button 27 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 5 NE #3 - Internal Enclosure 28 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 6 Module #6 - Lithium Ion Battery Cell NE #9 - Metal Support 29 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 7 Mod #5 - Heater 30 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 8 NE #11 - Bottom Enclosure 31 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 9 32 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 10 NE #11 - Bottom Enclosure NE #14 - Battery Holder 33 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 11 Battery Subsystem #2 34 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 12 NE #27 - O-Rings 35 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 13 NE #24 - Buttons NE #20 Light Guides NE #22 - LED Cover NE #18 - Cover Lock Button NE #15 - Enclosure Support #1 36 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Teardown Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Photo 14 NE #12 - Internal Enclosure NE #13 - Top Cover NE #16 - Cover Support #1 NE #23 - Spring NE #25 Gear w/ NE#26 Gear Stick NE #17 - Cover Support #2 NE #19 Metal Support NE #21 - Enclosure Support #2 37 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Component Function Guide Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd In both the Deep Dive and Survey Plus reports, ICs and modules will be categorized by their function within the system. These categories are in alignment with the high-level IC function categories currently found in IRIS. The categories will also be found in the updated excel BoM workbooks which are included with each report. Component Function Applications/Baseband Processor Processors which are both Apps/BB Processors Application Processor Main Processor without cellular modem Baseband Processor Cellular Modem Processor Camera / Image Image Sensors, Video processors, Image co-processors , VGA Camera Connectivity Antennas, Bluetooth, GPS, USB, WiFi, ZigBee components Display / Touchscreen Display driver, Touchscreen controller, etc. Logic CPLD, FPGA, Programmable Logic Array/PLA, PLD Memory: Mixed Components with both non-volatile and volatile memory Memory: Non-Volatile NAND, NOR, EEPROMs, etc. Memory: Volatile RAM, SDRAM, etc. Mixed Signal DSPs, MCUs, Mixed-Signal Arrays, (non-audio, non-apps, non-baseband) Processors Other Small logic AND, OR gates, LDOs, Transistors, Regulators Power Management / Audio Audio CODECs, Envelope Tracking, MEMS Microphone, Power Management RF Component Diplexers, RF Antenna, RF antenna switches, RF Filters, RF Power Amplifiers, RF Receivers, RF Transceivers, etc. Sensor Accelerometer, Barometer, Compass, Gyroscope, Heart, Pressure, Temperature 38 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Subsystems Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Battery Summary Battery Subsystem Pack Brand Pack Part Number Pack Voltage Cell Type Pack Rating (mAHrs) Pack Size (mm) Vol. Energy Density (mWHrs/cc) Pack Weight (grams) Wt. Energy Density (mWHrs/g) Cell Brand Cell(s) Electronic Parts Non-electronic Parts Estimated Costs Assembly Test Gross Margin Panasonic 1UR18650Z-C007A 3.7 Lithium Ion 2900 69.5 x 21.3 x 18.5 391.8 50.6 212.1 Sanyo $1.39 $0.32 $0.29 $0.16 $0.05 $0.95 Estimated Pack Price $3.16 A full Subsystem BOM is provided in the included BOM workbook. 39 Battery Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Subsystems Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Battery IC Identification 15 - Hitachi #MD1508 Battery Surveillance Function: Power Management / Audio 40 Battery Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Main Board Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Side 1 Enclosure Auxiliary Board 10.4 mm Auxiliary Board 17.8 mm Enclosure Assembly Side 1 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components IC Identification X-Rays & Die Photos Side 2 Teardown Photos 41 Cross - Section Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Main Board Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Side 1 IC Identification 5 - Texas Instruments #SN74LVC1G17 Single Schmitt-Trigger Buffer 3 - Texas Instruments #LM4040B20I 2 V Shunt Voltage Reference 2 - Texas Instruments #TPS797285 50 mA / 2.85 V LDO Regulator 1 - Texas Instruments #MSP430F2272 16-Bit Mixed Signal Microcontroller 6 - Texas Instruments #SN74LVC1G04 Single Schmitt-Trigger Inverter 4 - Texas Instruments #OPA330 Operational Amplifier Function: Mixed Signal Other Assembly Side 1 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components IC Identification X-Rays & Die Photos Side 2 Teardown Photos 42 Cross - Section Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Main Board Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Side 1 X-Rays & Die Photos 1 - Texas Instruments #MSP430F2272 16-Bit Mixed Signal Microcontroller Pkg. Size: 3.5 x 3.35 mm 1.1 - Texas Instruments #MSP430F2274G 16-Bit Mixed Signal Microcontroller Die Size: 3.5 x 3.35 mm Function: Mixed Signal Assembly Side 1 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components IC Identification X-Rays & Die Photos Side 2 Teardown Photos 43 Cross - Section Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Main Board Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Side 2 Trigger Button Battery (+) Assembly Side 1 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Side 2 Teardown Photos 44 Cross - Section Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Main Board Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Cross - Section 45 Side 1 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Side 2 Teardown Photos Cross - Section Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Other Substrates Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Auxiliary Board (Sides 1 & 2) Main Board Charger Contacts 9.3 mm 9.1 mm Main Board 46 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Other Substrates Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Auxiliary Board (Sides 1 & 2 ICs) 7 - Texas Instruments #OPA369 700 nA / 1.8 V Operational Amplifier Function: Other 47 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Other Substrates Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Charger Main Board (Side 1) 38.0 mm 62.5 mm Battery Connector 48 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Other Substrates Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Charger Main Board (Side 1 ICs) 8 - Texas Instruments #MSP430F5524 16-Bit Mixed-Signal Microcontroller 11 - Texas Instruments #TPD4E001 4-Channel ESD Protection Array 9 - Texas Instruments #TPS63021 Buck-Boost Converter 10 - Texas Instruments #BQ24190 Li-ion Battery Charger Function: Mixed Signal Other Power Management / Audio 49 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Other Substrates Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Charger Main Board (Side 1 Die Photos) 8 - Texas Instruments #MSP430F5524 16-Bit Mixed-Signal Microcontroller Pkg. Size: 5 x 5 mm 8.1 - Texas Instruments #MSP430F5529K 16-Bit Mixed-Signal Microcontroller Die Size: 3.78 x 3.77 mm Function: Mixed Signal 50 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Other Substrates Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Charger Main Board (Side 2) Control Buttons LED Indicators Main Device Contacts miniUSB 51 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Other Substrates Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Charger Main Board (Side 2 ICs) 13 - Texas Instruments #SN74LVC1G17 Single Schmitt-Trigger Buffer 14 - Alpha & Omega Semiconductor ? #Unknown ESD Protection TVS Diode Array 12 - Texas Instruments #TPS797285 50 mA / 2.85 V LDO Regulator Function: Other ? = Unconfirmed 52 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Other Substrates Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Charger Main Board Cross-Section 53 Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Teardown Photos Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Summaries Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Substrate Data Substrates Assembly Name Manufacturer Core Material Main Board Unknown FR4 Auxilary Board Unknown FR4 Charger Main Board Topsearch Printed Circuits (HK) LTD FR4 Mfg. Technology 6 Layer Buildup FR4 / HF 4 Layer Conventional FR4 / HF 6 Layer Buildup FR4 / HF Layers 6 4 6 Area (cm²) 1.8 0.7 5.7 Min. Trace Pitch (mm) 0.30 0.60 0.20 Min. Trace Width (mm) 0.10 0.20 0.10 ThruVia Land Dia (mm) ThruVia Hole Dia (mm) 0.60 0.40 0.55 0.20 0.20 0.22 BlindVia Land Dia (mm) BlindVia Hole Dia (mm) 0.30 0.00 0.25 0.00 Thickness (mm) 1.6 1.6 1.0 Routing Density Estimated Costs 56.8 $ 29.8 $ 49.0 $ 0.10 0.01 0.31 54 Substrate Data Front Page Device Analysis Product Label Assembly Metrics Cost by Assembly Component Costs Counts by Assembly Supporting Materials Block Diagram Features Components Teardown Photos IC Metrics IC Mfr. Distribution Component Function Guide Non-Electronics Subsystems Main Board Assembly Cost Total Other Substrates Summaries Overview & Discussion Summaries Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Electronic Assembly Metrics Number of Components Number of Connections 4 2.8 29.8 13 30 Main Electronics Charger Main Board 5.70 6 34.2 49.0 120 427 Main Electronics Main Board 1.80 6 10.8 56.8 67 208 8.20 16 47.8 200 665 Main Electronics Totals Subsystem Electronics Battery Subsystem: Battery Board Subsystem Electronics Totals System Totals 19.8 Assembly Weight (grams) Routing Density (cm of routing per sq.cm of substrate) 0.70 Avg. Pin Count Circuit Area (sq.cm) Auxilary Board Assembly Name Connection Density (Connections/sq.cm) Metal Layers Main Electronics General Area Component Density (Components/sq.cm) Substrate Area (sq.cm) Electronic Assembly Metrics by Assembly 18.6 42.9 2.3 0.03 21.1 74.9 3.6 3.20 37.2 115.6 3.1 0.80 24.4 81.1 3.3 4.03 1.80 2 3.6 10 28 5.6 15.6 2.8 0.60 1.80 2 3.6 10 28 5.6 15.6 2.8 0.60 10.0 18.0 51.4 210 693 21.0 69.3 3.3 4.63 NOTE: Occasional inconsistencies in totals may be present due to rounding error. 55 Substrate Data Front Page Device Analysis Product Label Assembly Metrics Cost by Assembly Component Costs Counts by Assembly Supporting Materials Block Diagram Features Components Teardown Photos IC Metrics IC Mfr. Distribution Component Function Guide Non-Electronics Subsystems Main Board Assembly Cost Total Other Substrates Summaries Overview & Discussion Summaries Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Electronic Cost by Assembly Card Test Insertion Substrates Connector Components Passive Components Modular & Odd Form Components Integrated Circuits Assembly Name Total General Area Small Active Components Electronics Costs by Assembly Main Electronics Auxilary Board $ 0.31 $ 0.06 $ $ 0.13 $ 0.03 $ $ 0.01 $ 0.06 $ 0.01 Main Electronics Charger Main Board $ 4.81 $ 1.81 $ 0.54 $ 0.58 $ 0.49 $ 0.26 $ 0.31 $ 0.67 $ 0.15 Main Electronics Main Board $ 3.29 $ 1.11 $ 1.06 $ 0.37 $ 0.19 $ 0.02 $ 0.10 $ 0.37 $ 0.05 $ 8.40 $ 2.98 $ 1.60 $ 1.08 $ 0.72 $ 0.28 $ 0.42 $ 1.11 $ 0.21 $ 0.47 $ 0.05 $ - $ 0.09 $ 0.02 $ 0.13 $ 0.03 $ 0.10 $ 0.05 $ 0.47 $ 0.05 $ - $ 0.09 $ 0.02 $ 0.13 $ 0.03 $ 0.10 $ 0.05 $ 8.87 $ 3.03 $ 1.60 $ 1.17 $ 0.74 $ 0.41 $ 0.45 $ 1.20 $ 0.26 Main Electronics Totals Subsystem Electronics Battery Subsystem Subsystem Electronics Totals System Totals - - NOTE: Occasional inconsistencies in totals may be present due to rounding error. 56 Substrate Data Front Page Device Analysis Product Label Assembly Metrics Cost by Assembly Component Costs Counts by Assembly Supporting Materials Block Diagram Features Components Teardown Photos IC Metrics IC Mfr. Distribution Component Function Guide Non-Electronics Subsystems Main Board Assembly Cost Total Other Substrates Summaries Overview & Discussion Summaries Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Electronic Component Costs Estimated Cost of Electronics Cost of Electronics $9.00 $0.26 (Includes Subsystem Electronics) $8.87 $1.20 $8.00 Card Test $0.45 $7.00 $0.41 Insertion $0.74 $6.00 Substrates $1.17 $5.00 Connector Components Passive Components $4.00 Small Active Components $1.60 Modular & Odd Form Components $3.00 Integrated Circuits $2.00 $3.03 $1.00 $- 57 Substrate Data Front Page Device Analysis Product Label Assembly Metrics Cost by Assembly Component Costs Counts by Assembly Supporting Materials Block Diagram Features Components Teardown Photos IC Metrics IC Mfr. Distribution Component Function Guide Non-Electronics Subsystems Main Board Assembly Cost Total Other Substrates Summaries Overview & Discussion Summaries Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Electronic Counts by Assembly Small Active Component Connections Passive Components Passive Component Connections Connectors Connector Connections Subsystem IOs Opportunities System Totals Small Active Components Battery Subsystem Modular/Odd Form Component Connections Auxilary Board Charger Main Board Main Board Modular/Odd Form Components Main Electronics Main Electronics Main Electronics Main Electronics Totals Subsystem Electronics Subsystem Electronics Totals Assembly Name IC Connections General Area IC Package Count Counts by Assembly 1 7 7 15 1 1 16 5 124 76 205 6 6 211 0 4 3 7 0 0 7 0 14 8 22 0 0 22 4 15 9 28 1 1 29 9 50 27 86 8 8 94 8 91 47 146 5 5 151 16 228 96 340 10 10 350 0 3 1 4 3 3 7 0 11 1 12 4 4 16 0 0 0 0 2 2 2 43 547 275 865 40 40 905 NOTE: Occasional inconsistencies in totals may be present due to rounding error. 58 Substrate Data Front Page Device Analysis Product Label Assembly Metrics Cost by Assembly Component Costs Counts by Assembly Supporting Materials Block Diagram Features Components Teardown Photos IC Metrics IC Mfr. Distribution Component Function Guide Non-Electronics Subsystems Main Board Assembly Cost Total Other Substrates Summaries Overview & Discussion Summaries Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd IC Metrics Non-Volatile Memory (KBytes) Volatile Memory (KBytes) Package Connections per sq.cm of Package Area Die Area/Package Area Ratio Package Area (sq.mm) Substrate Tiling Density (die area / substrate area) Die Area (sq.mm) IC Package Count Assembly Name IC Die Count General Area Number of Package Connections IC Metrics Main Electronics Auxilary Board 1 1 5 0.7 0.01 2.8 0.27 181.4 0 0 Main Electronics Charger Main Board 7 7 124 26.6 0.05 60.6 0.44 204.6 0 0 Main Electronics Main Board 0.09 Main Electronics Totals Subsystems Battery Subsystem Subsystem Electronics Totals System Totals 7 7 76 16.7 20.6 0.81 369.8 0 0 15 15 205 44.0 83.9 0.52 244.3 0 0 1 1 6 0.6 2.0 0.29 3.0 0 0 1 1 6 0.6 2.0 0.29 300.0 0 0 16 16 211 44.6 85.9 0.52 245.6 0 0 NOTE: Occasional inconsistencies in totals may be present due to rounding error. 59 Substrate Data Front Page Device Analysis Product Label Assembly Metrics Cost by Assembly Component Costs Counts by Assembly Supporting Materials Block Diagram Features Components Teardown Photos IC Metrics IC Mfr. Distribution Component Function Guide Non-Electronics Subsystems Main Board Assembly Cost Total Other Substrates Summaries Overview & Discussion Summaries Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd IC Manufacturer Distribution Pkg. Brand 100.00% Texas Instruments Hitachi Alpha & Omega Semiconductor 0.92% 99.50% Cost $2.95 $0.05 $0.03 Alpha & Omega Semiconductor 99.00% 98.50% 1.74% 98.00% Hitachi 97.50% 97.00% Texas Instruments 97.34% 96.50% 96.00% Vendor Share % NOTE: Occasional inconsistencies in totals may be present due to rounding error. 60 Substrate Data Front Page Device Analysis Product Label Assembly Metrics Cost by Assembly Component Costs Counts by Assembly Supporting Materials Block Diagram Features Components Teardown Photos IC Metrics IC Mfr. Distribution Component Function Guide Non-Electronics Subsystems Main Board Assembly Cost Total Other Substrates Summaries Overview & Discussion Summaries Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Non-Electronic Cost Part ID No. Qty Device Main Enclosures 1 2 3 1 1 1 Long Enclosure Short Enclosure Internal Enclosure Molded + Pulls + Painted Molded + Pulls + Painted + Printed Extruded + Machined + Painted + Printed Plastic Plastic Aluminum Device Miscellaneous 4 5 6 7 8 9 1 1 1 1 1 1 Internal Support Cigarette Holder Enclosure Support Button Light Guide Metal Support Stamped + Formed + Co-Molded + Pulls Molded + Pulls Molded + Painted Molded + Painted Molded Stamped + Formed Metal + Plastic Plastic Plastic Plastic Plastic + Adhesive Metal Charger Main Enclosures 10 11 12 13 1 1 1 1 Top Enclosure Bottom Enclosure Internal Enclosure Top Cover Molded Molded Molded Molded PC PC PC PC Charger Miscellaneous 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 1 Battery Holder Enclosure Support #1 Cover Support #1 Cover Support #2 Cover Lock Button Metal Support Light Guides Enclosure Support #2 LED Cover Spring Buttons Gear Gear Stick O-Ring Short Foam Tape Long Foam Tape Molded + Pulls Molded + Heat Staked Molded + Pulls Molded Stamped + Formed + Co-Molded + Painted Stamped + Formed Molded + Co-Molded Molded Molded + Painted Extruded + Formed Molded + Painted + Printed Molded Molded Molded Die-Cut Die-Cut Subsystem Total Description Fabrication Process + + + + Pulls Pulls Pulls Pulls + + + + Material Printed + Painted Printed + Painted Painted + Printed Heat Staked + Painted + + + + ABS ABS ABS ABS Plastic Plastic Plastic Plastic Metal + Plastic Metal Plastic Plastic + Adhesive Plastic + Adhesive Metal Plastic Plastic Plastic Rubber Plastic + Adhesive Plastic + Adhesive Dimensions (mm) 54.3 x 14.95 x 14 37.2 x 14.6 x 13.9 74.3 x 12 x 11.9 65 x 11.6 x 11.15 26 x 11.5 x 11.5 13.9 x 13.7 x 4.8 31.3 x 9.6 x 5.9 10 x 5.65 x 5 10.65 x 5 x 3.5 93.4 x 51 93.4 x 51 112.5 x 51 51.15 x 27.9 x x x x 11.5 11.5 18.8 21.3 72.9 x 24.3 x 16.4 33.3 x 19 x 6.15 25.3 x 25.2 x 15 25.3 x 25.2 x 7.8 22.2 x 11.7 x 15.5 28.2 x 7.5 x 4.3 26.2 x 5 x 4 32 x 28 x 8.4 54.2 x 8.4 x 0.5 22.1 x 9.6 x 2.4 16.4 x 7.4 x 1.9 6.8 x 6.8 x 3 19 x 10 x 5.5 3 x 3 x 0.5 26 x 5.3 x 0.8 64 x 5.3 x 0.8 31 Total Weight Est'd Cost Est'd (grams) Each Extended Cost 3.10 1.70 2.30 $0.660 $0.610 $0.440 $0.660 $0.610 $0.440 2.60 0.60 0.10 0.20 0.10 0.12 $0.480 $0.430 $0.020 $0.020 $0.020 $0.010 $0.480 $0.430 $0.020 $0.020 $0.020 $0.010 8.90 8.80 12.40 5.60 $1.050 $1.050 $0.790 $0.480 $1.050 $1.050 $0.790 $0.480 4.30 0.80 1.50 1.40 0.50 0.20 0.30 0.50 0.30 0.30 0.10 0.10 0.30 0.02 0.40 0.40 $0.270 $0.070 $0.260 $0.050 $0.100 $0.040 $0.020 $0.020 $0.050 $0.020 $0.030 $0.010 $0.100 $0.010 $0.010 $0.020 $0.270 $0.070 $0.260 $0.050 $0.100 $0.040 $0.020 $0.020 $0.050 $0.020 $0.030 $0.010 $0.100 $0.020 $0.020 $0.020 Estimated Cost $7.16 61 Substrate Data Front Page Device Analysis Product Label Assembly Metrics Cost by Assembly Component Costs Counts by Assembly Supporting Materials Block Diagram Features Components Teardown Photos IC Metrics IC Mfr. Distribution Component Function Guide Non-Electronics Subsystems Main Board Assembly Cost Total Other Substrates Summaries Overview & Discussion Summaries Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Assembly Cost Total Estimated Cost Totals Total System Costs Percentage 100.00% 2.83% 90.00% 80.00% 37.16 % Final Assembly & Test Battery Pack Non-Electronic Parts $ $ 3.16 7.16 Final Assembly & Test $ 0.55 $ 19.27 Cost Total Notes: Estimated final assembly cost includes labor only. 16.40% Total cost does not include Non-recurring, R&D, G&A, IP licensing fees/royalties, software, sales & marketing, distribution. Battery Pack 40.00% 8.40 Note: An additional $3.21 estimated for accessories and supporting materials Non-Electronic Parts 50.00% $ Total 70.00% 60.00% Main Electronic Assemblies Assumes fully scaled production. 30.00% 43.62% 20.00% Main Electronic Assemblies Final Assembly & Test Made in Number of parts Est'd number of steps Est'd time (seconds) 10.00% 0.00% Est'd final assembly cost Est'd final test cost Malaysia 38 122 414 $ 0.35 $ 0.20 62 Substrate Data Front Page Device Analysis Product Label Assembly Metrics Cost by Assembly Component Costs Counts by Assembly Supporting Materials Block Diagram Features Components Teardown Photos IC Metrics IC Mfr. Distribution Component Function Guide Non-Electronics Subsystems Main Board Assembly Cost Total Other Substrates Summaries Overview & Discussion Overview & Discussion Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd COST ESTIMATION PROCESS Overview and Discussion Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses, unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices. Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of the output of the model across product families and over time. TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the results based on substitution of their own component cost estimates where they have better information based on inside knowledge. Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer, defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type, and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources. Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennas, batteries and displays are costed from a set of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption for the country of origin, we then calculate final assembly cost. The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries (as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also documented and estimated for their contribution to total cost as appropriate. We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions (smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce. Please feel free to contact us at support@techinsights.com with any comments, questions, or proposed corrections with respect to our cost estimates. We welcome your input. 63 Cost Estimation Process Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Metrics Teardown Photos Report Revisions Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Overview & Discussion Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Metrics Overview and Discussion In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either “raw” measured data or ratios of these measured data sets. Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine. Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging technologies. High density circuit boards are also often a supporting technology. Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting. Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces). Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly. Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the ‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits. Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example, with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high pincount logic. Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of placement, number of placements, and engineering of part clearances. Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a given application, but the metric provides a ready measure of wiring complexity. 64 Cost Estimation Process Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Metrics Teardown Photos Report Revisions Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion Overview & Discussion Deep Dive Teardown Philip Morris IQOS A1402 - SI45079-TMd Revisions Overview and Discussion Periodically we will make revisions to these reports. In the event a revision is made, the information below may be referenced as a summary of the changes which were made. Rev. D - Initial Release 65 Cost Estimation Process Front Page Device Analysis Product Label Supporting Materials Block Diagram Features Components Metrics Teardown Photos Report Revisions Component Function Guide Subsystems Main Board Other Substrates Summaries Overview & Discussion